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ieee research paper on agriculture

IEEE/CAA Journal of Automatica Sinica

  • JCR Impact Factor: 11.8 , Top 4% (SCI Q1) CiteScore: 17.6 , Top 3% (Q1) Google Scholar h5-index: 64, TOP 7

A Survey on Smart Agriculture: Development Modes, Technologies, and Security and Privacy Challenges

Doi:  10.1109/jas.2020.1003536.

  • Xing Yang 1 ,  , 
  • Lei Shu 2, 5 ,  ,  , 
  • Jianing Chen 3 ,  , 
  • Mohamed Amine Ferrag 4 ,  , 
  • Jun Wu 3 ,  , 
  • Edmond Nurellari 5 ,  , 
  • Kai Huang 1 , 

College of Engineering, Nanjing Agricultural University, Nanjing 210031, China

School of Cyber Security, Shanghai Jiao Tong University, Shanghai 200240, China

Department of Computer Science, Guelma University, B.P. 401, 24000, Algeria

School of Engineering, University of Lincoln, Lincoln LN67TS, UK

the National Natural Science Foundation of China   62072248

the National Natural Science Foundation of China   61902188

in part by China Postdoctoral Science Foundation   2019M651713

Xing Yang (M'20) received the M.S. degree in control engineering from Nanjing University of Information Science and Technology, China, in 2018. He is currently working toward the Ph.D. degree in the college of engineering, Nanjing Agricultural University, China. His current research interests include fault diagnosis in wireless sensor networks, agricultural Internet of Things reliability, and machine learning algorithm

Lei Shu (SM'07) received the B.S. degree in computer science from South Central University for Nationalities, China, in 2002, and the M.S. degree in computer engineering from Kyung Hee University, South Korea, in 2005, and the Ph.D. degree from the Digital Enterprise Research Institute, National University of Ireland, Galway, Ireland, in 2010. Until 2012, he was a Specially Assigned Researcher with the Department of Multimedia Engineering, Graduate School of Information Science and Technology, Osaka University, Japan. He is currently a Distinguished Professor with Nanjing Agricultural University, China, and a Lincoln Professor with the University of Lincoln, U.K. He is also the Director of the NAU-Lincoln Joint Research Center of Intelligent Engineering. He has published over 400 papers in related conferences, journals, and books in the areas of sensor networks and Internet of Things. His current H-index is 58 and i10-index is 218 in Google Scholar Citation. His current research interests include wireless sensor networks and Internet of Things. He has also served as a TPC member for more than 150 conferences, such as ICDCS, DCOSS, MASS, ICC, GLOBECOM, ICCCN, WCNC, and ISCC. He was a recipient of the 2014 Top Level Talents in Sailing Plan of Guangdong Province, China, the 2015 Outstanding Young Professor of Guangdong Province, and the GLOBECOM 2010, ICC 2013, ComManTel 2014, WICON 2016, SigTelCom 2017 Best Paper Awards, the 2017 and 2018 IEEE Systems Journal Best Paper Awards, the 2017 Journal of Network and Computer Applications Best Research Paper Award, and the Outstanding Associate Editor Award of 2017, and the 2018 IEEE ACCESS. He has also served over 50 various Co-Chair for international conferences/workshops, such as IWCMC, ICC, ISCC, ICNC, Chinacom, especially the Symposium Co-Chair for IWCMC 2012, ICC 2012, the General Co-Chair for Chinacom 2014, Qshine 2015, Collaboratecom 2017, DependSys 2018, and SCI 2019, the TPC Chair for InisCom 2015, NCCA 2015, WICON2016, NCCA2016, Chinacom2017, InisCom2017, WMNC 2017, and NCCA 2018

Jianing Chen received the B.S. degree (with Hons.) from the School of Electronic and Information Engineering in Beihang University, Beijing, China, in 2018. He is currently working toward the M.S. degree at the School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, China. His current research interests include industrial control systems (ICS), blockchain and cryptography

Mohamed Amine Ferrag received the Bachelor's degree (June, 2008), Master's degree (June, 2010), Ph.D. degree (June, 2014), HDR degree (April, 2019) from Badji Mokhtar-Annaba University, Algeria, all in Computer Science. Since October 2014, he is a senior lecturer at the Department of Computer Science, Guelma University, Algeria. Since July 2019, he is a Visiting Senior Researcher, NAU-Lincoln Joint Research Center of Intelligent Engineering, Nanjing Agricultural University, China. His research interests include wireless network security, network coding security, and applied cryptography. He has been conducting several research projects with international collaborations on these topics. He has published more than 60 papers in international journals and conferences in the above areas. Some of his research findings are published in top-cited journals, such as the IEEE Communications Surveys & Tutorials, IEEE Internet of Things Journal, IEEE Transactions on Engineering Management, IEEE Access, Journal of Information Security and Applications (Elsevier), Transactions on Emerging Telecommunications Technologies (Wiley), Telecommunication Systems (Springer), International Journal of Communication Systems (Wiley), Sustainable Cities and Society (Elsevier), Security and Communication Networks (Wiley), and Journal of Network and Computer Applications (Elsevier). He has participated in many international conferences worldwide, and has been granted short-term research visitor internships to many renown universities including, De Montfort University, UK and Istanbul Technical University, Turkey. He is currently serving on various editorial positions such as Editorial Board Member in Journals (Indexed SCI & Scopus) such as, IET Networks and International Journal of Internet Technology and Secured Transactions (Inderscience Publishers). He has served as an Organizing Committee Member (Track Chair, Co-Chair, Publicity Chair, Proceedings Editor, Web Chair) in numerous international conferences such as ICNAS'13'15'17, ASD'16, EUSPN'17, (AINIS) Symposium'17, ANT'17, SEIT'17, IEEE ICCE'18'19, and IEEE ITIA'20

Jun Wu (M'08) received the Ph.D. degree in information and telecommunication studies from Waseda University, Japan. He was a Post-Doctoral Researcher with the Research Institute for Secure Systems, National Institute of Advanced Industrial Science and Technology, Japan, from 2011 to 2012. He was a Researcher with the Global Information and Telecommunication Institute, Waseda University, from 2011 to 2013. He is currently an Associate Professor of Electronic Information and Electrical Engineering with Shanghai Jiao Tong University, China. His research interests include the advanced computation and communications techniques of smart sensors, wireless communication systems, industrial control systems, wireless sensor networks, and smart grids. He has hosted and participated in several research projects for the National Natural Science Foundation of China, National 863 Plan, and 973 Plan projects. He has been a Guest Editor of the IEEE SENSORS journal and a TPC Member of several international conferences, including WINCON 2011 and GLOBECOM 2015

Edmond Nurellari received his B.Sc and his M.Sc degree in Electrical and Electronic Engineering, both from Eastern Mediterranean University, Northern Cyprus, in 2010 and in 2012 respectively. From September 2010 to February 2013, he served as a Research and Teaching Assistant in the department of Electrical and Electronic Engineering at Eastern Mediterranean University. In 2013, he was awarded the Leeds International Research Scholarship (LIRS) to pursue his Ph. D. at the School of Electronics and Electrical Engineering, University of Leeds, United Kingdom. Since April 2017, he has been a faculty member with the School of Engineering at the University of Lincoln, United Kingdom, where he is currently a Lecturer in Electrical Engineering/Robotics. His research interests includes distributed signal processing, signal processing on graphs, resource allocations, distributed decisions and network security analysis in wireless sensor networks by employing tools from graph theory and game theory. He has served as an Invited Reviewer for the IEEE Transactions on Signal and Information Processing over Networks, IEEE Communication Letter, Springers Wireless Networks Journal, Springers Digital Signal Processing Journal and IEEE Flagship conferences

Kai Huang received the Ph.D. degree in agricultural engineering from China Agricultural University, China, in 2018. He is currently a Postdoctoral Researcher in the Department of Electrical Engineering at Nanjing Agricultural University, Nanjing, China. His main research includes agricultural Internet of Things. He has guest edited the special issue on Smart Agricultural Applications with Internet of Things in Sensors. He has served as a PC Members in the IoT Computing Systems area of 3PGCIC-2019

  • Corresponding author: Lei Shu.e-mail: [email protected]
  • Recommended by Associate Editor MengChu Zhou.
  • Revised Date: 2020-10-01
  • Accepted Date: 2020-11-17
  • Agricultural artificial intelligence , 
  • agricultural automation , 
  • agricultural Internet of Things , 
  • security , 
  • smart agriculture

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通讯作者: 陈斌, [email protected].

沈阳化工大学材料科学与工程学院 沈阳 110142

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ieee research paper on agriculture

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  • Figure 1. Characteristics and confronted issues of agriculture development (from Agriculture 1.0 to Agriculture 4.0).
  • Figure 2. Organization of this paper. Development modes, 7 key technologies, and 11 applications of smart agriculture are summarized in Section Ⅱ and Ⅲ, which contribute to discuss security issues in Section Ⅳ, Ⅴ and Ⅵ.
  • Figure 3. Research fields of smart agriculture based on 1) precision agriculture, 2) facility agriculture, and 3) order agriculture.
  • Figure 4. Various technologies and applications based on IoT architecture.
  • Figure 5. Indoor conditions and outdoor environment of poultry and livestock breeding, e.g., (a) indoor conditions for chicken farm, (b) outdoor environment for sheep breeding, (c) indoor conditions for hog farm, and (d) outdoor environment for cattle breeding.
  • Figure 6. SIL-IoT component and communication diagram. The insecticidal range is smaller than the communication range, which ensures that the SIL-IoT nodes deployed in the field meet the communication requirements.
  • Figure 7. Massive data fusion among satellites, aircraft, UAVs, and surface stations.
  • Figure 8. Comparison of edge computing and cloud computing. The advantages of edge computing are low cost and low delay, which benefit to high time efficiency tasks, e.g., SIL-IoT, agricultural UVAs, driverless tractors.
  • Figure 9. (a) Fixed-wing UAV, (b) single-rotor hydraulic UAV, and (c) multi-rotor electric UAV. Currently, electric multi-rotor UAVs have a major market share due to their low cost, low failure rate, simple operation, and environmental protection.
  • Figure 10. Different security and privacy countermeasures for 7 key technologies and 11 key applications in smart agriculture.
  • Figure 11. Interference on different distances between SIL and receiving node. Average communication duration values of 0 cm, 5 cm, and 10 cm are 45.6 s, 116.5 s, and 765.9 s. Maximum values of 0 cm, 5 cm, and 10 cm are 151 s, 422 s, and 1970 s. Minimum values of 0 cm, 5 cm, and 10 cm are 4 s, 4 s, and 45 s.
  • Figure 12. Data acquisition under interference. For the first line, "2020-07-08-15-15:34:32" is time format, "02" is sensor ID in red dotted box, "26.6" is temperature (℃) in yellow dotted box, and "72" is relative humidity (%) in green dotted box. Besides, data in blue dotted box are normal data, data in violet dotted box are abnormal data, and data in grey dotted box are device reset information.
  • Figure 13. When a variety of data is transmitted to the cloud or edge node, hackers access the database through unauthorized access.
  • Figure 14. In the process of node communication, hackers intercept data by invading receiving nodes.
  • Figure 15. System fault, link fault, sensor fault, and other factors lead to uneven spraying of pesticides.
  • Figure 16. Due to malicious data attacks, the solar insecticidal lamps in an actual pest outbreak area are sleeping, which leads to crops damage. Simultaneously, we have a waste of energy caused by incorrect responses of the solar insecticidal lamps that are in the false pest outbreak area.
  • Figure 17. A driverless tractor operating on the wrong route after a control system intrusion.
  • Figure 18. The novel mode of agricultural production by FoE architecture.
  • Figure 19. The security scheme of renewable EMS, including 1) fault self-diagnosis of hardware and software in agricultural facilities and renewable energy equipment, 2) identity authentication and data encryption in data transmission layer, 3) intrusion detection and data backup in background management.
  • Figure 20. A plant phenotype information system based on SDN architecture (including multiple data sources, control pane, data pane, and application layer) and security issues (trust between applications and controller, wrong control instructions, and abnormal data flow) result from hacker attacks.
  • Figure 21. Future research trends, security challenges, and lessons learned about smart agriculture.

Crop Recommendation System using Machine Learning Algorithms

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School of Electrical and Computer Engineering

College of engineering, student research on thermoelectric harvesters recognized.

ieee research paper on agriculture

Aug 30, 2023

Xi Li has won third place in the Best Student Paper Contest at the IEEE International Midwest Symposium on Circuits and Systems in Phoenix, Arizona on August 6-9. The award recognizes his outstanding contribution in the field of power and energy circuits and systems. Li, a Ph.D. candidate in the Georgia Tech School of Electrical and Computer Engineering ,  is a member of Professor Gabriel A. Rincón-Mora’s research team at the Georgia Tech Analog, Power, and Energy IC Research Lab (GTAPE), whose mission is to develop, design, and build silicon-based microchips and microsystems that harness power from tiny batteries, fuel cells, coils, and ambient sources, like motion, light, heat, and radiation to supply and sustain mobile, portable, and self-sustaining devices for biomedical, consumer, industrial, and military applications.

Xi's winning paper, titled “Maximum Power-Point Theory for Thermoelectric Harvesters,” shows how linear losses in the energy-harvesting circuit that draws power from the thermoelectric source reduce the direct current voltage of the source and quadratic losses raise the series resistance. This phenomenon not only decreases the power delivered to the load but also shifts the maximum power point of the system. With the model developed by Xi, engineers can more easily and more effectively design thermoelectric harvesters so they output the highest power possible.

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IMPACT 2023 Call For Papers

Submission deadline 21 June, 2023

IMPACT 2023 Conference , organized by IEEE-EPS-Taipei, iMAPS-Taiwan, ITRI, and TPCA, is the largest gathering of PCB and packaging professionals in Taiwan. This year's event will be held from Oct. 25th-27th at Taipei Nangang Exhibition Center in conjunction with TPCA Show 2023. The symposium will focus on the theme “IMPACT on the future of HPC, AI, and Metaverse" , exploring the latest electronic technologies and fostering collaboration among enterprises and organizations.


*Scope covers from PACKAGING TO PCB; papers relevant to the below scopes are encouraged to submit but NOT limited to.

P1. Advanced Packaging Technologies

Wafer-level packaging, Panel-level packaging, Flip chip packaging, Chip scale packaging, Fan-in/fan-out technologies, Multi-chip modules, Fine pitch/high pin packaging solution, Heterogeneous integration (side-by-side integration, vertical stacking integration, chiplet, high bandwidth memory), High performance computing package, Si interposer, Organic interposer, Fanout package, Si bridge, Advanced substrate, 3DIC, Hybrid bonding, TSV, Wafer bonding, Mobile heterogeneous integration (SiP, PoP, PiP etc.), and Other new technologies for advanced microelectronics.

P2. Power Electronics Packaging

Si/GaN/SiC based power device and module (IGBT, MOSFET, HEMT, diode, IPM etc.), Power electronic module systems (inverter, converter, rectifier etc.), Fabrication and assembly, Low-temperature bonding, Sintered Ag/Au bonding, Solid-Liquid Interdiffusion (SLID) bonding, Interconnection (wire-bonding, Cu clip bonding, chip embedded PCB etc.), Encapsulant material, Advanced cooling system, Ceramic substrate technologies (DBC, IMS, DPC, AMB etc.), High-performance passive components (super capacitor, inductor etc.), and Other related technologies.

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